NISMO

Epoxy Resin Circuit Board Potting Compound Waterproof, 2110, 2.5 Grams

Description: Technical Product Bulletin HIGH IMPACT EPOXY STAKING COMPOUND ROOM TEMPERATURE CURE PRODUCT DESCRIPTION: AA-BOND 2110 is a thixotropic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repair and manufacturing applications where long pot-life, good wetting, non-sag, non-drip and improved impact strength properties are required. AA-BOND 2110 is easy-to-use two parts adhesive system contains no volatile solvents, readily cures at room temperature, and bonds to most materials including glass and glass fabrics, ceramics, wood, leather, most metals, and many plastics. AA-BOND 2110 is strong, tough, resilient, has superior mechanical impact and thermal shock resistance characteristics, and is also highly resistant to weather, water, gases and vapors, most petroleum products and fuels, salts, mild acids and alkalis, and many other organic and inorganic compounds. GENERAL PROPERTIES: Appearance: Hazy off white Cure Type: Benefits: Room temperature or Heat cure High Impact strengthGood wettingLong pot life Mix Ratio by weight: 100:30 / Resin:Hardener Substrates: Staking components, bonding, laminating, repair applications, metals, glass, ceramics, wood and many plastics Operating Temperature: -40 to 100 °C Typical Applications: PCB components, aerospace, anything where superior properties are required UNCURED PROPERTIES: Specific Gravity, mixed: 1.25 g/cc Viscosity @25 °C, cps: 65000 Pot Life: 1 hour CURE SCHEDULE: 10 hours @ 65°C 24 hours @ 25°C MISC PROPERTIES: Volume Resistivity: 9.30e+8 ohm-cm Dielectric Constant: 4.7 Dielectric Strength: 430 kV/in CTE, linear: 30.5 µin/in-°F @ RT Hardness, Shore D: 80 GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). HOW TO USE: 1) Carefully clean and dry all surfaces to be bonded. 2) Apply AA-BOND 2110 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured. 3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use. 4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results. AVAILABILITY: This epoxy can be supplied in various different packages. Data Sheets: TDS | MSDS available upon request. Froo www.froo.com | Froo Cross Sell, Free Cross Sell, Cross promote, eBay Marketing, eBay listing Apps, eBay Apps, eBay Application

Price: 9.99 USD

Location: Warwick, Rhode Island

End Time: 2024-08-12T17:39:44.000Z

Shipping Cost: 0 USD

Product Images

Epoxy Resin Circuit Board Potting Compound Waterproof,  2110,  2.5 GramsEpoxy Resin Circuit Board Potting Compound Waterproof,  2110,  2.5 Grams

Item Specifics

All returns accepted: ReturnsNotAccepted

Brand: Atom Adhesives

Model: 2110

MPN: AA-BOND 2110

Country/Region of Manufacture: United States

Benefit:: High Impact strength Good wetting Long pot life

Cure Type:: Room temperature or Heat cure

Appearance:: Hazy off white

Substrates 1:: Staking components, bonding, laminating

Substrates 2:: repair applications, metals, glass, ceramics

Substrates 3:: wood and many plastics

Operating Temperature:: -70 to 100 °C

Typical Applications:: PCB components, aerospace

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